The low-contamination shock wave fragmentation process is suitable for processes with high purity requirements. Due to the use of acoustic shock waves and the low level of contact compared to conventional fragmentation methods, metal contamination is kept to a minimum (<10 ppm) during the treatment process.
Since it uses electrically generated shock waves, shock wave fragmentation does not engage in any form of direct mechanical interaction with the target materials, unlike classical fragmentation methods, which means that it can be viewed as a non-contact approach to milling. No contact with a solid state grinding body means there is also no increased wear during the processing of hard, abrasive materials. This makes it possible to efficiently process hard, abrasive materials without facing the problem of high wear. The shock wave method used by ImpulsTec generates comparatively few impurities due to erosion on the electrodes. In recent years, several different research projects allowed a significant amount of expertise to be gained in the low-contamination fragmentation of semiconductor materials and the processing of high-purity ceramics as well as glass products.
Examples include the high-purity milling of ceramic monoliths and various glass products. The low-contamination shock wave process can be used to obtain high-purity reusable material fractions.
Advantages for applications
- non-contact fragmentation process
- efficient fragmentation of hard and abrasive materials
- processing of materials with high purity standards
- content of metal contamination <10 ppm achievable (depending on the target particle size)
High purity treatment of glass with shock wave process